Speaking at the ceremony, Modi said the new plant signals the birth of semiconductor clusters across the country and the beginning of a large‑scale employment and economic transformation, as India builds the entire electronics value chain from components to chips under the Viksit Bharat roadmap.
The Sanand OSAT unit, part of the India Semiconductor Mission, will handle assembly, packaging and testing of chips. Modi noted that the facility was designed with partners from Thailand and Japan and can produce about 20 crore chips a year, with plans to scale to more than 500 crore chips annually – roughly 1.5 crore chips per day – as the ecosystem matures.
The project’s timeline was highlighted: the foundation stone was laid in 2024, chip testing began in August 2025, and commercial production has now commenced. Modi was presented with the first chips made at the plant, which are slated for export to Japan.
Emphasising the role of youth, Modi urged young Indians not to miss the opportunities presented by the AI and robotics era, and highlighted that many women from remote regions who completed ITI training are now employed at the plant, some having travelled to Malaysia for advanced semiconductor training.
The launch was framed as a milestone in India’s broader manufacturing surge, moving from a reliance on imported mobile phones to becoming the world’s second‑largest mobile phone manufacturer and exporter, and even producing aircraft such as the C‑295. Modi linked the plant to the government’s ‘Design in India’ and ‘Make in India’ initiatives and said it exemplifies technology, trust and collaboration.
Looking ahead, the prime minister said the government aims to build a complete domestic semiconductor ecosystem – from design to fabrication and packaging – step‑by‑step, brick‑by‑brick, to support the Viksit Bharat‑2047 vision.